Circuit board structure and method for manufacturing the same

A method for manufacturing a circuit board structure is provided. First, a first circuit layer is formed on a carrier. Then, a first dielectric layer is formed on the carrier and the first circuit layer. Then, at least one first hole is formed in the first dielectric layer to expose a part of the fi...

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Bibliographic Details
Main Authors CHENG, SHIH-LIANG, HU, DYIUNG, CHEN, YU-HUA
Format Patent
LanguageChinese
English
Published 16.12.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:A method for manufacturing a circuit board structure is provided. First, a first circuit layer is formed on a carrier. Then, a first dielectric layer is formed on the carrier and the first circuit layer. Then, at least one first hole is formed in the first dielectric layer to expose a part of the first circuit layer. Then, a second dielectric layer is formed on the first dielectric layer and the first circuit layer. Then, at least one ditch and at least one second hole are formed in the second dielectric layer, in which the ditch exposes a part of the first dielectric layer, and the second hole exposes a part of the first circuit layer. Finally, a metal layer is filled in the ditch and the second hole.
Bibliography:Application Number: TW20150119260