Apparatus and method for thermally treating substrates
The invention relates to an apparatus and a method for treating one or more substrates (2), comprising a process chamber (3) and a susceptor (1) which can be heated by a heating device (4) which comprises a plurality of zone heating devices (4'), wherein a first zone heating device (4') he...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.10.2016
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Abstract | The invention relates to an apparatus and a method for treating one or more substrates (2), comprising a process chamber (3) and a susceptor (1) which can be heated by a heating device (4) which comprises a plurality of zone heating devices (4'), wherein a first zone heating device (4') heats a first zone (A) of the susceptor (1) and a second zone heating device (4') heats a second zone (B) of the susceptor (1), wherein a control device (5) is associated with each zone (A, B), the control variable of said control device being a temperature measured with at least one temperature measuring device (6) on the first side (1') of each zone (A, B), which temperature is regulated to a target value by controlling the heating power fed into the associated zone heating device (4'). It is proposed that the control variable of the second zone (B) is a temperature of the free surface of the substrate (2) and, in addition, a temperature of the free surface of the first side (1') of the susceptor (1) is measured in the secon |
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AbstractList | The invention relates to an apparatus and a method for treating one or more substrates (2), comprising a process chamber (3) and a susceptor (1) which can be heated by a heating device (4) which comprises a plurality of zone heating devices (4'), wherein a first zone heating device (4') heats a first zone (A) of the susceptor (1) and a second zone heating device (4') heats a second zone (B) of the susceptor (1), wherein a control device (5) is associated with each zone (A, B), the control variable of said control device being a temperature measured with at least one temperature measuring device (6) on the first side (1') of each zone (A, B), which temperature is regulated to a target value by controlling the heating power fed into the associated zone heating device (4'). It is proposed that the control variable of the second zone (B) is a temperature of the free surface of the substrate (2) and, in addition, a temperature of the free surface of the first side (1') of the susceptor (1) is measured in the secon |
Author | LUENENBUERGER, MARKUS LANGNER, JOST-MARTIN THERES, ARNE |
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Snippet | The invention relates to an apparatus and a method for treating one or more substrates (2), comprising a process chamber (3) and a susceptor (1) which can be... |
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SubjectTerms | AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUSPOLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COLORIMETRY CRYSTAL GROWTH DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING METALLURGY PHYSICS PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE RADIATION PYROMETRY REFINING BY ZONE-MELTING OF MATERIAL SEMICONDUCTOR DEVICES SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITHDEFINED STRUCTURE SINGLE-CRYSTAL-GROWTH SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL ORUNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL |
Title | Apparatus and method for thermally treating substrates |
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