Apparatus and method for thermally treating substrates

The invention relates to an apparatus and a method for treating one or more substrates (2), comprising a process chamber (3) and a susceptor (1) which can be heated by a heating device (4) which comprises a plurality of zone heating devices (4'), wherein a first zone heating device (4') he...

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Bibliographic Details
Main Authors LANGNER, JOST-MARTIN, LUENENBUERGER, MARKUS, THERES, ARNE
Format Patent
LanguageChinese
English
Published 16.10.2016
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Summary:The invention relates to an apparatus and a method for treating one or more substrates (2), comprising a process chamber (3) and a susceptor (1) which can be heated by a heating device (4) which comprises a plurality of zone heating devices (4'), wherein a first zone heating device (4') heats a first zone (A) of the susceptor (1) and a second zone heating device (4') heats a second zone (B) of the susceptor (1), wherein a control device (5) is associated with each zone (A, B), the control variable of said control device being a temperature measured with at least one temperature measuring device (6) on the first side (1') of each zone (A, B), which temperature is regulated to a target value by controlling the heating power fed into the associated zone heating device (4'). It is proposed that the control variable of the second zone (B) is a temperature of the free surface of the substrate (2) and, in addition, a temperature of the free surface of the first side (1') of the susceptor (1) is measured in the secon
Bibliography:Application Number: TW20160101542