Thermosetting adhesive composition, thermosetting adhesive film, and composite film

• Main Authors: HARADA, RYU, TOCHIHIRA, JUN
• Format: Patent
• Language: Chinese; English
• Published: 01.09.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING-UP

A thermosetting adhesive composition according to the present invention contains: a component (A) that is a vinyl compound in which ends of a bifunctional polyphenylene ether oligomer are substituted with vinly groups; a component (B) that is a maleimide resin; and a component (C) that is a thermoplastic elastomer, wherein an equivalent ratio of the vinyl groups in the component (A) to maleimide groups in the component (B) is 1.0:0.5 to 1.0:4.0, a content ratio of the component (C), relative to the total weight of the component (A), the component (B), and the component (C), is 55 to 95% by weight, a content ratio of styrene units in the component (C), relative to the total weight of the component (C), is 10 to 40% by weight, a tensile stress at 100% elongation is 0.1 to 2.9 MPa, and an elongation at break is 100% or more.