Module and manufacturing method thereof
The present invention provides a module to ensure rigidity and to increase the ratio of the mounting area. The module is comprised of: a first substrate having a plurality of electrodes; a first element having a plurality of electrodes bonded to the first substrate; a second substrate having a reces...
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.08.2016
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention provides a module to ensure rigidity and to increase the ratio of the mounting area. The module is comprised of: a first substrate having a plurality of electrodes; a first element having a plurality of electrodes bonded to the first substrate; a second substrate having a recess portion laminated on the first substrate; and a second element having a plurality of electrodes bonded to the recess portion of the second substrate, an end of the first element electrically coupled the electrodes of the first element to the electrodes of the first substrate; another end of the first element which is opposite to said end electrically coupled the electrodes of the first element to the electrodes of the second element through a through-hole disposed on the recess portion. |
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| AbstractList | The present invention provides a module to ensure rigidity and to increase the ratio of the mounting area. The module is comprised of: a first substrate having a plurality of electrodes; a first element having a plurality of electrodes bonded to the first substrate; a second substrate having a recess portion laminated on the first substrate; and a second element having a plurality of electrodes bonded to the recess portion of the second substrate, an end of the first element electrically coupled the electrodes of the first element to the electrodes of the first substrate; another end of the first element which is opposite to said end electrically coupled the electrodes of the first element to the electrodes of the second element through a through-hole disposed on the recess portion. |
| Author | TAKI, TOMOHITO SUZU, SOICHIRO |
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| Notes | Application Number: TW20165102188 |
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| RelatedCompanies | MITSUMI ELECTRIC CO., LTD |
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| Snippet | The present invention provides a module to ensure rigidity and to increase the ratio of the mounting area. The module is comprised of: a first substrate having... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Module and manufacturing method thereof |
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