Module and manufacturing method thereof

The present invention provides a module to ensure rigidity and to increase the ratio of the mounting area. The module is comprised of: a first substrate having a plurality of electrodes; a first element having a plurality of electrodes bonded to the first substrate; a second substrate having a reces...

Full description

Saved in:
Bibliographic Details
Main Authors SUZU, SOICHIRO, TAKI, TOMOHITO
Format Patent
LanguageChinese
English
Published 01.08.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The present invention provides a module to ensure rigidity and to increase the ratio of the mounting area. The module is comprised of: a first substrate having a plurality of electrodes; a first element having a plurality of electrodes bonded to the first substrate; a second substrate having a recess portion laminated on the first substrate; and a second element having a plurality of electrodes bonded to the recess portion of the second substrate, an end of the first element electrically coupled the electrodes of the first element to the electrodes of the first substrate; another end of the first element which is opposite to said end electrically coupled the electrodes of the first element to the electrodes of the second element through a through-hole disposed on the recess portion.
Bibliography:Application Number: TW20165102188