Flexible packaging architecture
A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the w...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.06.2016
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Subjects | |
Online Access | Get full text |
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Summary: | A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die. |
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Bibliography: | Application Number: TW20154127741 |