Flexible packaging architecture

A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the w...

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Bibliographic Details
Main Authors PERIAMAN, SHANGGAR, CHEW, YEN HSIANG, KONG, JACKSON CHUNG PENG, OOI, KOOI CHI, SKINNER, MICHAEL, ABD RAZAK, RIDZA EFFENDI, CHEAH, BOK ENG, MAR, KHENG TAT
Format Patent
LanguageChinese
English
Published 16.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.
Bibliography:Application Number: TW20154127741