Methods & apparatus for obtaining diagnostic information relating to a lithographic manufacturing process, lithographic processing system including diagnostic apparatus

A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors (202) within a lithographic apparatus, and/or a separate metrology tool (240). Other inspections tools (244, 2...

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Main Authors TSUGAMA, NAOKO, VIEYRA SALAS, JORGE ALBERTO, VAN DER WILK, RONALD, JANSSEN, EDWIN JOHANNES MARIA, VAN DEN OEVER, PETRUS JOHANNES, VAN SCHIJNDEL, ANTONIUS HUBERTUS, BRULS, RICHARD JOSEPH, HAUPTMANN, MARC, HOEKERD, KORNELIS TIJMEN, JANSSEN, PAUL, DAVIES, DYLAN JOHN DAVID
Format Patent
LanguageChinese
English
Published 16.06.2016
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors (202) within a lithographic apparatus, and/or a separate metrology tool (240). Other inspections tools (244, 248) perform wafer backside inspection and/or reticle backside inspection to produce second measurement data 302. High-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed (CORR) to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map (506) is used to identify potentially relevant clusters of defects in the more detailed original defect map (520). The responsible apparatus can be identified by pattern recognition (PREC) as part of automated root cause analysis.
Bibliography:Application Number: TW20154133083