Method of processing a substrate

A method of processing a substrate or panel is disclosed. A substrate having thereon an array of chips is provided. A mask layer is laminated on the substrate. The mask layer has a plurality of openings to reveal active areas of the chips respectively. A spray-coating process is then performed to fo...

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Main Authors LU, HUNGIEH, TSENG, HOIEH, HUANG, YEN-HENG, CHUANG, WEIUNG, CHEN, CHUNG-KAI, TSENG, CHUN-LIN, CHENG, LI-TING, HUANG, CHANG-KUEI, CHEN, CHIOUI, HUANG, SHIHIEH
Format Patent
LanguageChinese
English
Published 01.06.2016
Subjects
CALCULATING
COMPUTING
COUNTING
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
ELECTRIC DIGITAL DATA PROCESSING
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Summary:A method of processing a substrate or panel is disclosed. A substrate having thereon an array of chips is provided. A mask layer is laminated on the substrate. The mask layer has a plurality of openings to reveal active areas of the chips respectively. A spray-coating process is then performed to form an adhesive film in the active areas. The mask layer is then stripped off.
Bibliography:Application Number: TW20143141265