Polyamic acid, polyimide, resin film, and metal-clad laminate

• Main Authors: SHIBASAKI, TAKUYA, ANDO, TOMONORI, SUTO, YOSHIKI, MORI, AKIRA, ADACHI, YASUHIRO
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

The present invention provides a polyamic acid by reacting a diamine component and an acid anhydride component containing a tetracarboxylic acid anhydride. Relative to total diamine component, the diamine component contains a diamine compound represented by general formula (i) in the range of 10-60 mol%. Relative to total acid anhydride component, the acid anhydride component contains one or more types of tetracarboxylic acid anhydride selected from the group consisting of pyromellitic dianhydride (PMDA) and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (BPDA) in the range of 50-100 mol%. In the formula, R represents a C1-8 alkyl group, and p represents a number of 1 to 4; in which when p is 2 or higher, R may independently have any number of carbons.