Semiconductor light emitting device and lead frame

According to one embodiment, a semiconductor light emitting device includes a lead frame; a chip mounted on the lead frame, the chip including a substrate and a light emitting element provided on the substrate; a wall section including an inner wall facing to a side portion of the chip, and an outer...

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Main Authors INOUE, KAZUHIRO, TAKEUCHI, TERUO, EGOSHI, HIDENORI, KUROKI, TOSHIHIRO, NOGUCHI, YOSHIO, ARAKAWA, TAKASHI, OGUSHI, MASAHIRO
Format Patent
LanguageChinese
English
Published 16.03.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to one embodiment, a semiconductor light emitting device includes a lead frame; a chip mounted on the lead frame, the chip including a substrate and a light emitting element provided on the substrate; a wall section including an inner wall facing to a side portion of the chip, and an outer wall on an opposite side to the inner wall; and a phosphor layer provided on at least the chip. A distance between the side portion of the chip and the inner wall of the wall section is smaller than a thickness of the chip. An angle between an upper surface of the lead frame and the inner wall is smaller than an angle between the upper surface of the lead frame and the outer wall.
Bibliography:Application Number: TW20154128920