Polycarboxylic acid and polycarboxylic acid composition containing same, epoxy resin composition, thermosetting resin composition, and cured material of same, and optical semiconductor device

• Main Authors: KAWADA, YOSHIHIRO, YARITA, MASATO, MIYAGAWA, NAOFUSA, AOKI, SHIZUKA, TANAKA, EIICHI
• Format: Patent
• Language: Chinese; English
• Published: 16.03.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HETEROCYCLIC COMPOUNDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The purpose of the present invention is to provide: a polycarboxylic acid and polycarboxylic acid composition containing the same, an epoxy resin composition, and a thermosetting resin composition having minimal volatility when cured and excellent curing properties, whereby a cured material thereof has excellent transparency and hardness, the glass transition temperature of the cured material can be adequately increased, and excellent moldability and minimal coloring of the cured material are obtained; a cured material of the aforementioned compositions; and a semiconductor device. This polycarboxylic acid is represented by formula (1). (In formula (1), R1 represents a C1-6 alkylene group, and R6 represents a hydrogen atom or a C1-10 organic group containing a carboxyl group. In formula (1), the plurality of R1 and R6 may each be the same or different, but 50 mol% or more of the plurality of R6 are C1-10 organic groups containing a carboxyl group.)