LED heat dissipation structure

The present invention relates to an LED heat dissipation structure. The LED heat dissipation structure comprises a printed circuit board and a substrate standing on the printed circuit board. An LED unit is configured on one surface of the substrate, and a heat dissipation sheet is configured on ano...

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Bibliographic Details
Main Authors WU, YI-HSIN, CHENG, HSIENIE, CHEN, CHUNG-DE
Format Patent
LanguageChinese
English
Published 01.03.2016
Subjects
BLASTING
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF
HEATING
LIGHTING
MECHANICAL ENGINEERING
STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR
WEAPONS
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Summary:The present invention relates to an LED heat dissipation structure. The LED heat dissipation structure comprises a printed circuit board and a substrate standing on the printed circuit board. An LED unit is configured on one surface of the substrate, and a heat dissipation sheet is configured on another surface of the substrate. The LED heat dissipation structure is characterized in that the heat dissipation sheet is extending through a perforation on the printed circuit board and connecting with a heat dissipation ring for heat dissipation.
Bibliography:Application Number: TW20140129997