Process for making a molded device assembly and printhead assembly

In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit b...

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Bibliographic Details
Main Authors GROH, MICHAEL G, STRAND, THOMAS R, CHEN, CHIEN HUA
Format Patent
LanguageChinese
English
Published 01.02.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.
Bibliography:Application Number: TW20150114267