Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member

• Main Authors: AMAKAWA, TSUYOSHI, MIURA, MUNEO, OKADA, HIROKAZU, URAGAMI, HIROSHI
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2016
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES

The present invention provides a method for producing an electronic component, capable of simply and efficiently producing an electronic component having both of a via e1ectrode(s) (bump(s)) and a plate-like member. The method is a method for producing an electronic component. The electronic component includes: a substrate 21, a chip(s) 31, a resin 41, a plate-like member 11, a bump(s) 12, and a wiring pattern 22 formed on the substrate 21. The method includes encapsulating the bump(s) 31 in the resin 41. The encapsulating includes: encapsulating the chip(s) 31 in the resin 41 between a bump 12-formed surface of a bump-formed plate-like member 10 including the plate-like member 11 and the bump(s) 12 formed using the plate-like member 11 and includes a deformable portion 12A capable of being shrunk in the direction perpendicular to a plane direction of the plate-like member 11 and a wiring pattern 22-formed surface of the substrate 21; and causing the bump(s) 12 to be in contact with the wiring pattern 22.