Bonding wire for semiconductor device
Provided is a bonding wire that has improved bonding reliability and ball-forming performance in a ball joint and that is suitable for an automotive device. A bonding wire for a semiconductor device that has a Cu alloy core material and a Pd coating layer that is formed on the surface of the Cu allo...
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| Main Authors | , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
16.01.2016
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Provided is a bonding wire that has improved bonding reliability and ball-forming performance in a ball joint and that is suitable for an automotive device. A bonding wire for a semiconductor device that has a Cu alloy core material and a Pd coating layer that is formed on the surface of the Cu alloy core material, wherein the Cu alloy core material contains Ni, the concentration of Ni relative to the entire wire is 0.1-1.2% by weight, and the thickness of the Pd coating layer is 0.015-0.150 [mu]m. |
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| AbstractList | Provided is a bonding wire that has improved bonding reliability and ball-forming performance in a ball joint and that is suitable for an automotive device. A bonding wire for a semiconductor device that has a Cu alloy core material and a Pd coating layer that is formed on the surface of the Cu alloy core material, wherein the Cu alloy core material contains Ni, the concentration of Ni relative to the entire wire is 0.1-1.2% by weight, and the thickness of the Pd coating layer is 0.015-0.150 [mu]m. |
| Author | DEAI, HIROYUKI UNO, TOMOHIRO OYAMADA, TETSUYA |
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| Notes | Application Number: TW20154112804 |
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| PublicationYear | 2016 |
| RelatedCompanies | NIPPON STEEL & SUMIKIN MATERIALS CO., LTD NIPPON MICROMETAL CORPORATION |
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| Snippet | Provided is a bonding wire that has improved bonding reliability and ball-forming performance in a ball joint and that is suitable for an automotive device. A... |
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| SubjectTerms | ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS METALLURGY SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| Title | Bonding wire for semiconductor device |
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