Substrate treatment apparatus

• Main Authors: MIYASHITA, TAKUYA, SEGAWA, SATOSHI, OSADA, NAOYUKI
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2015
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CALCULATING; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; COMPUTING; CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; PERFORMING OPERATIONS; PHYSICS; REGULATING; SEMICONDUCTOR DEVICES; SPRAYING OR ATOMISING IN GENERAL; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TRANSPORTING

A valve control unit (23) includes a data reading/selecting unit (500), which reads each of signals transmitted onto a serial bus, and selects a flow rate data signal from among the read signals. Therefore, the valve control unit (23) can acquire the flow rate data signal from the serial bus without allowing the flow rate data signal to pass via the master IC (300). As a result, it is made possible to ensure real time properties of feedback control, which adjusts a needle valve (407) based on a measurement result of a flowmeter (26), while reducing a load applied to a CPU that controls the master IC (300). Moreover, it is not necessary to provide an additional instrument for transferring analog signals between slave devices, and accordingly, a size increase and cost increase of an apparatus can be suppressed.