Adjusting eddy current measurements

Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick(t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t; receiving a measured temperatu...

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Bibliographic Details
Main Authors SWEDEK, BOGUSLAW A, XU, KUN, BENNETT, DOYLE E, TU, WENIANG, LIU, TZU-YU, CARLSSON, INGEMAR, SHEN, SHIH-HAUR, IRAVANI, HASSAN G
Format Patent
LanguageChinese
English
Published 16.09.2015
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:Among other things, a method of controlling polishing during a polishing process is described. The method includes receiving a measurement of a thickness, thick(t), of a conductive layer of a substrate undergoing polishing from an in-situ monitoring system at a time t; receiving a measured temperature, T(t), associated with the conductive layer at the time t; calculating resistivity [rho]T of the conductive layer at the measured temperature T(t); adjusting the measurement of the thickness using the calculated resistivity [rho]T to generate an adjusted measured thickness; and detecting a polishing endpoint or an adjustment for a polishing parameter based on the adjusted measured thickness.
Bibliography:Application Number: TW20150103605