Holding stand

The subject of the present invention is to stably remove a ring reinforced portion without reducing an element area of a wafer with the ring reinforced portion formed around the element area of a wafer. The solution is a wafer processing method, which is a method to process a wafer held on a frame t...

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Bibliographic Details
Main Authors DEJIMA, TAKESHI, KIMURA, SAKI, TSUCHIYA, TOSHIO
Format Patent
LanguageChinese
English
Published 16.08.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The subject of the present invention is to stably remove a ring reinforced portion without reducing an element area of a wafer with the ring reinforced portion formed around the element area of a wafer. The solution is a wafer processing method, which is a method to process a wafer held on a frame through an adhesive tape, wherein the wafer has the element area formed with elements and an outer peripheral residual area of a convex ring reinforced portion arranged around the element area. Furthermore, it is made up that the element area and the boundary of the peripheral residual area are irradiated by laser light to cut off the ring reinforced portion on the wafer and the ring reinforced portion is removed from the wafer.
Bibliography:Application Number: TW20140145482