Methods and apparatus for forming flowable dielectric films having low porosity
Provided herein are methods and apparatus for forming flowable dielectric films having low porosity. In some embodiments, the methods involve plasma post-treatments of flowable dielectric films. The treatments can involve exposing a flowable film to a plasma while the film is still in a flowable, re...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.08.2015
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Subjects | |
Online Access | Get full text |
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Summary: | Provided herein are methods and apparatus for forming flowable dielectric films having low porosity. In some embodiments, the methods involve plasma post-treatments of flowable dielectric films. The treatments can involve exposing a flowable film to a plasma while the film is still in a flowable, reactive state but after deposition of new material has ceased. |
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Bibliography: | Application Number: TW20143136882 |