Partitioned cooling for electronic devices and systems

Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone...

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Bibliographic Details
Main Authors REDDY, ANAND V, VARADARAJAN, KRISHNAKUMAR
Format Patent
LanguageChinese
English
Published 16.07.2015
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Summary:Partitioned cooling for electronic devices and systems. An embodiment of an apparatus includes a casing; one or more components, including one or more components that include an active thermal element; a partition to separate area within the casing into a first cooling zone and a second cooling zone, wherein the first cooling zone provides cooling for the one or more components that include an active thermal element; and a first fan located in the first cooling zone, the first fan to produce airflow for cooling in the first cooling zone and a second fan located in the second cooling zone to produce airflow for the cooling in the second cooling zone.
Bibliography:Application Number: TW20143132424