Photosensitive resin composition, photosensitive element, mask material for sandblast, and surface processing method for workpiece

• Main Authors: YOSHIDA, TETSUYA, ITAGAKI, SHUUICHI, OZAWA, KYOUKO
• Format: Patent
• Language: Chinese; English
• Published: 16.07.2015
• Subjects: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL; ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTROGRAPHY; GRINDING; HOLOGRAPHY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The invention provides a photosensitive resin composition, which contains (A) a binder polymer having a carboxyl group, (B) a photopolymerizable compound having an ethylene unsaturated group, (C) a photopolymerization initiator, (D) a plasticizer containing a phosphorus, and (E) a silane compound. And the (B) constituent, i.e., the photopolymerizable compound having an ethylene unsaturated group, includes a (meth) acrylate urethane compound.