Epoxy resin composition, semiconductor sealing agent, and semiconductor device

An epoxy resin composition characterized by including (A) an epoxy resin, (B) a curing agent, (C) 0.1-10% by mass of a silica filler having an average particle diameter of 10-100 nm, and (D) 40-75% by mass of a silica filler having an average particle diameter of 0.3-5 [mu]m, the epoxy resin composi...

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Bibliographic Details
Main Authors YAMAZAWA, TOMOYA, OKOSHI, KODAI, ABE, NOBUYUKI, KOHARA, KAZUYUKI
Format Patent
LanguageChinese
English
Published 16.07.2015
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:An epoxy resin composition characterized by including (A) an epoxy resin, (B) a curing agent, (C) 0.1-10% by mass of a silica filler having an average particle diameter of 10-100 nm, and (D) 40-75% by mass of a silica filler having an average particle diameter of 0.3-5 [mu]m, the epoxy resin composition including a total of 40.1-77% by mass of component (C) and component (D).
Bibliography:Application Number: TW20143141181