Semiconductor device

A semiconductor device (100) is provided with: a semiconductor chip (10) that is provided with an electrode pad (12); and a wire (30) that is electrically connected to the electrode pad (12). The wire (30) is configured from a first metal material that is mainly composed of Ag and contains Pd. The e...

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Bibliographic Details
Main Author ITOH, SHINGO
Format Patent
LanguageChinese
English
Published 01.05.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device (100) is provided with: a semiconductor chip (10) that is provided with an electrode pad (12); and a wire (30) that is electrically connected to the electrode pad (12). The wire (30) is configured from a first metal material that is mainly composed of Ag and contains Pd. The electrode pad (12) is configured from a second metal material that is mainly composed of Al. An alloy layer that contains Ag, Al and Pd is formed on a joint part (40) of the wire (30) and the electrode pad (12).
Bibliography:Application Number: TW20143120653