Method of manufacturing package component for light emitting diode and package structure thereof

• Main Authors: CHEN, CHENG-YEN, CHIN, CHUNIEH, LI, YUN-LI
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2015
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A method of manufacturing package component for light emitting diode is disclosed. The method comprises the following steps of: disposing at least one light emitting diode disposed on a substrate inside a photocuring resin, wherein the light emitting diode is covered completely by the substrate and the photocuring resin; providing a power to the light emitting diode to make the light emitting diode emit a plurality of light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold; performing a separation process to separate the male mold and the other portion of the photocuring resin, the light emitting diode and the substrate; performing a rollover process to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold; and performing a forming process to form a package component with a shape identical to that of the male mold.