Anneal module for semiconductor wafers

• Main Authors: MOORE, ROBERT B, FRANCISCHETTI, VINCENT STEFFAN, HANSON, KYLE M, WIRTH, PAUL, WILSON, GREGORY J
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500 DEG C processes. The anneal module may include a process chamber formed in a metal body having internal cooling line...