Anneal module for semiconductor wafers

An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500 DEG C processes. The anneal module may include a process chamber formed in a metal body having internal cooling line...

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Bibliographic Details
Main Authors MOORE, ROBERT B, FRANCISCHETTI, VINCENT STEFFAN, HANSON, KYLE M, WIRTH, PAUL, WILSON, GREGORY J
Format Patent
LanguageChinese
English
Published 16.04.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An anneal module for annealing semiconductor material wafers and similar substrates reduces particle contamination and oxygen ingress while providing uniform heating including for 500 DEG C processes. The anneal module may include a process chamber formed in a metal body having internal cooling lines. A hot plate has a pedestal supported on a thermal choke on the body. A gas distributor in the lid over the hot plate flows gas uniformly over the wafer. A transfer mechanism moves a hoop to shift the wafer between the hot plate and a cold plate.
Bibliography:Application Number: TW20143128126