Thermosetting resin composition and use thereof

• Main Authors: DU, CUI-MING, CHAI, SONG-GANG, HAO, LIANG-PENG
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2015
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention discloses a thermosetting resin composition. The composition comprises thermosetting resin, a curing agent, an accelerator, an organic molybdenum compound, organic silicon powder and inorganic filler which are prepared into prepreg through an impregnation way or prepared into a coating through a coating way. The composition can be used for remarkably lowering a coefficient of thermal expansion and water absorption of a composite material, improving a bonding interface between the resin and the inorganic filler, improving interlayer adhesiveness of a laminated board and improving drilling processability of the laminated board.