Substrate processing method, substrate processing apparatus, method for manufacturing semiconductor device and computer-readable recording medium

This substrate processing method comprises: a step wherein a substrate, which is provided with a prebaked film that has a silazane bond, is carried into a process chamber; a modification step wherein the substrate is heated to a first temperature and a processing gas is supplied to the substrate; an...

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Main Authors OKUNO, MASAHISA, KAKUDA, TORU, TATENO, HIDETO, KUROKAWA, MASAMICHI, JODA, TAKUYA
Format Patent
LanguageChinese
English
Published 01.04.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:This substrate processing method comprises: a step wherein a substrate, which is provided with a prebaked film that has a silazane bond, is carried into a process chamber; a modification step wherein the substrate is heated to a first temperature and a processing gas is supplied to the substrate; and a drying step wherein the substrate is heated at a second temperature that is higher than the first temperature but not higher than the temperature of the prebaking.
Bibliography:Application Number: TW20143126162