Testing apparatus and method for microcircuit and wafer level IC testing

• Main Authors: ROTT, STEVE, HALVORSON, BRIAN, CAMPION, DAN, ANDRES, MICHAEL, ESHULT, BRIAN, DEBAUCHE, JOHN, SHERRY, JEFFREY
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2015
• Subjects: GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TESTING

The test system provides an array of test probes having a cross beam. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. The probes are biased upwardly through the retainer by an elastomeric block having a similar array of slots. The elastomer is then capped at its bottom by a second or lower retainer with like slots to form a sandwich with the elastomer therebetween. The bottom ends of the probes are group by probe height. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and take continue the circuits to a probe card where test signals originate.