Thermosetting resin composition, cured film, substrate with cured film and electronic component

The invention relates to a thermosetting resin composition, a cured film, a substrate with a cured film and an electronic component. The thermosetting resin composition includes: one or more carboxyl group containing compound (A) selected from a group consisting of compounds represented by the follo...

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Bibliographic Details
Main Authors FURUTA, TOMOTSUGU, KIKUCHI, AYAKO, MOROKOSHI, SHINTA
Format Patent
LanguageChinese
English
Published 16.03.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:The invention relates to a thermosetting resin composition, a cured film, a substrate with a cured film and an electronic component. The thermosetting resin composition includes: one or more carboxyl group containing compound (A) selected from a group consisting of compounds represented by the following formulae (i-1)-(i-2) and formulae (ii-1)-(ii-4), and an epoxy compound (B) having fluorene backbone.
Bibliography:Application Number: TW20143125521