Light emitting apparatus

• Main Authors: MATSUMOTO, KATSUHISA, SASAKI, AKIHIRO, BETSUDA, NOBUHIKO
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2015
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

The disclosed embodiments provides a light emitting apparatus (110, 110a, 110b, 110c, 110d) including a heat dissipation plate(51), semiconductor light emitting elements (20), an installation substrate portion (15), and connection layer (52), wherein the installation substrate portion (15) includes ceramic substrate (10), a first metal layer (11), and a second metal layer (12). The ceramic substrate (10) is disposed between the heat dissipation plate(51) and the semiconductor light emitting elements (20). The installation substrate portion (15) connects with the ceramic substrate (10) between the heat dissipation plate (51) and the ceramic substrate (10), and includes a first surface (12b), on the side of the heat dissipation plate (51), and a side surface (12c), intersecting with a plane perpendicular toward a direction from the heat dissipation (51) to the semiconductor light emitting elements (20). The connection layer (52) is disposed between the heat dissipation layer (51) and the second metal layer (12)