Semiconductor device and method of manufacturing same

To provide a semiconductor device having improved reliability. In a wiring board of BGA, an insulation layer has thereon a plurality of bonding leads. The insulation layer is comprised of a prepreg having a glass cloth and a resin layer not having the glass cloth. The prepreg has thereon the resin l...

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Bibliographic Details
Main Authors KONNO, JUMPEI, SUGIYAMA, MICHIAKI
Format Patent
LanguageChinese
English
Published 16.02.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:To provide a semiconductor device having improved reliability. In a wiring board of BGA, an insulation layer has thereon a plurality of bonding leads. The insulation layer is comprised of a prepreg having a glass cloth and a resin layer not having the glass cloth. The prepreg has thereon the resin layer. The bonding leads are arranged directly on the soft resin layer and are therefore supported by this soft resin layer. When a load is applied to each of the bonding leads during flip chip bonding, the resin layer sinks, by which a stress applied to a semiconductor chip can be relaxed.
Bibliography:Application Number: TW20143112076