Precursor substrate, flexible circuit board and process for producing the same

• Main Authors: KUAN, FENG-PING, CHAO, CHIH-MIN, HSIAO, CHIHNG, LEE, YING-WEI, LEE, WEING, KUO, PEIR-RONG, CHIANG, CHIA-HUA, CHIU, CHIEN-HWA
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2015
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The instant disclosure provides a method of manufacturing a precursor substrate, at least comprising the following steps: providing a substrate; adhesively enhancing the surface of the substrate by using an adhesion enhancer; forming an adhesion enhancing layer on the surface of the substrate; fixing an electrical conducting layer on the surface of the substrate; and completely coating a metal layer on the electrical conducting layer, as a result, forming a precursor substrate. The instant disclosure also provides a precursor substrate, comprising: a substrate having a surface which is adhesively enhanced and has an adhesion enhancing layer; an electrical conducting layer adhered onto the adhesion enhancing layer; and a metal layer completely coated on the electrical conducting layer, thusly enclosing the whole surface of the electrical conducting layer.