Precursor substrate, flexible circuit board and process for producing the same

The instant disclosure provides a method of manufacturing a precursor substrate, at least comprising the following steps: providing a substrate; adhesively enhancing the surface of the substrate by using an adhesion enhancer; forming an adhesion enhancing layer on the surface of the substrate; fixin...

Full description

Saved in:
Bibliographic Details
Main Authors KUAN, FENG-PING, CHAO, CHIH-MIN, HSIAO, CHIHNG, LEE, YING-WEI, LEE, WEING, KUO, PEIR-RONG, CHIANG, CHIA-HUA, CHIU, CHIEN-HWA
Format Patent
LanguageChinese
English
Published 01.02.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The instant disclosure provides a method of manufacturing a precursor substrate, at least comprising the following steps: providing a substrate; adhesively enhancing the surface of the substrate by using an adhesion enhancer; forming an adhesion enhancing layer on the surface of the substrate; fixing an electrical conducting layer on the surface of the substrate; and completely coating a metal layer on the electrical conducting layer, as a result, forming a precursor substrate. The instant disclosure also provides a precursor substrate, comprising: a substrate having a surface which is adhesively enhanced and has an adhesion enhancing layer; an electrical conducting layer adhered onto the adhesion enhancing layer; and a metal layer completely coated on the electrical conducting layer, thusly enclosing the whole surface of the electrical conducting layer.
Bibliography:Application Number: TW20132125524