Polyimide, resin film and metal clad laminate

At least one layer of polyimide layers in a resin film is a nonthermoplastic polyimide layer of which a thermal linear expansion coefficient ranges from 1×10-6 (1/K) to 30×10-6 (1/K). The nonthermoplastic polyimide layer is obtained from a reaction of an anhydride constituent including an aromatic t...

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Bibliographic Details
Main Authors ANDO, TOMONORI, MORI, AKIRA, HARA, AIKO, KONDO, EIGO
Format Patent
LanguageChinese
English
Published 01.01.2015
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:At least one layer of polyimide layers in a resin film is a nonthermoplastic polyimide layer of which a thermal linear expansion coefficient ranges from 1×10-6 (1/K) to 30×10-6 (1/K). The nonthermoplastic polyimide layer is obtained from a reaction of an anhydride constituent including an aromatic tetracarboxylic anhydride, and a diamine constituent. The diamine constituent includes a dimer acid-type diamine and an aromatic diamine, in which the dimer acid-type diamine is obtained from two end carboxylic acid groups of a dimer acid substituted by a primary amino methyl group or an amino group, and includes a polyimide containing 1 mol% to 15 mol% of the dimer acid-type diamine with respect to all diamine constituents.
Bibliography:Application Number: TW20143122195