Evaporation device and use the evaporation device for evaporation process

• Main Author: HUANG, CHUN-YUN
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2014
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses an evaporation device and use the evaporation device for evaporation process. By using the linkage to control the multiple activities boards to form the panel which located between the cooling plate and evaporation source, and when a panel adsorption evaporant reaches the set value, using the linkage to control the multiple activities boards synchronous rotation to form a new panel, to continue the evaporation process. Thus greatly improve the panel's ability of adsorption evaporant, avoid the panel adsorbed too much evaporant to cause cracking phenomenon of falling off, to effectively increase the production rate of evaporation device.