Substrate wettability-promoting composition, polishing composition containing same, and method for producing substrates using same

• Main Authors: HORI, KATSUNOBU, NAGAHARA, KAYOKO, HIRANO, KAZUYUKI
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2014
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

Provided is a high-quality substrate wettability-promoting composition that is free of or almost free of impurities. The present invention contains a hydrophilic component composed mainly of a cellulose derivative, and a solvent component. Impurities derived from producing the cellulose derivative are equal to or less than 0.1 mass%.