Systems for the recycling of wire-saw cutting fluid

A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the...

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Bibliographic Details
Main Authors ERK, HENRY FRANK, GRABBE, ALEXIS, KWESKIN, SASHA JOSEPH, SHIVE, LARRY WAYNE
Format Patent
LanguageChinese
English
Published 01.09.2014
Subjects
BROACHING
FILING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PLANING
SAWING
SCRAPING
SHEARING
SLOTTING
TRANSPORTING
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Summary:A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.
Bibliography:Application Number: TW20132143077