Module substrate and module

A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of B...

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Bibliographic Details
Main Authors SASAKI, KEN, TAKEZAKI, TOORU, TASAKA, NAOYUKI
Format Patent
LanguageChinese
English
Published 16.08.2014
Subjects
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Summary:A module substrate includes: a multilayered wiring substrate that includes wiring layers; and embedded duplexers that are embedded in the multilayered wiring substrate and electrically connected to the wiring layers, wherein the embedded duplexers include duplexers supporting at least two bands of Band1, Band2, Band5, and Band8.
Bibliography:Application Number: TW20132144477