Reducing MEMS stiction by introduction of a carbon barrier

A mechanism for reducing stiction in a MEMS device by decreasing an amount of carbon from TEOS-based silicon oxide films that can accumulate on polysilicon surfaces during fabrication is provided. A carbon barrier material film (510, 520) is deposited between one or more polysilicon layer (210, 230)...

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Bibliographic Details
Main Authors MONTEZ, RUBEN B, STEIMLE, ROBERT F
Format Patent
LanguageChinese
English
Published 16.08.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A mechanism for reducing stiction in a MEMS device by decreasing an amount of carbon from TEOS-based silicon oxide films that can accumulate on polysilicon surfaces during fabrication is provided. A carbon barrier material film (510, 520) is deposited between one or more polysilicon layer (210, 230) in a MEMS device and the TEOS-based silicon oxide layer (220). This barrier material blocks diffusion of carbon into the polysilicon, thereby reducing accumulation of carbon on the polysilicon surfaces. By reducing the accumulation of carbon, the opportunity for stiction due to the presence of the carbon is similarly reduced.
Bibliography:Application Number: TW20132145770