Curable resin composition, and cured product of same

The purpose of the present invention is to provide a curable resin composition which enables the formation of a cured material having excellent heat resistance, transparency and flexibility, particularly excellent reflow resistance and an excellent barrier property against corrosive gases. The curab...

Full description

Saved in:
Bibliographic Details
Main Authors NAKAGAWA, YASUNOBU, KAMURO, SHIGEAKI
Format Patent
LanguageChinese
English
Published 16.08.2014
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online AccessGet full text

Cover

More Information
Summary:The purpose of the present invention is to provide a curable resin composition which enables the formation of a cured material having excellent heat resistance, transparency and flexibility, particularly excellent reflow resistance and an excellent barrier property against corrosive gases. The curable resin composition according to the present invention is characterized by comprising a polyorganosiloxane (A), a silsesquioxane (B), an isocyanurate compound (C) and a silane coupling agent (D), wherein the polyorganosiloxane (A) is a polyorganosiloxane having no aryl group, and a ladder-type silsesquioxane is contained as the silsesquioxane (B).
Bibliography:Application Number: TW20143100828