Bonding method and structure for LED package

A bonding method and structure for LED package is provided, wherein the bonding structure includes an adherent layer formed on a surface of a substrate of a LED chip and having transparency, a first metal layer formed on the adherent layer, a second metal layer formed on a package substrate, and mul...

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Bibliographic Details
Main Authors CHUANG, TUNG-HAN, LIN, JIAN-SHIAN, HUANG, MENGI, SU, YING-TSUN
Format Patent
LanguageChinese
English
Published 01.07.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bonding method and structure for LED package is provided, wherein the bonding structure includes an adherent layer formed on a surface of a substrate of a LED chip and having transparency, a first metal layer formed on the adherent layer, a second metal layer formed on a package substrate, and multiple metal combination layers which are formed by which a third metal layer formed on at least one of the first and second metal layers respectively diffuses to the first and second layers during heating the bonding structure. The melting point of the third metal layer is lower than those of the first and second metal layers. Through the bonding structure, the LED package has higher bonding intensity and higher emission efficiency.
Bibliography:Application Number: TW20121149187