Photosensitive resin composition and black spacer using the same

Disclosed are a photosensitive resin composition including (A) a thermally curing initiator having a half-life of one hour at a temperature ranging from 100 to 150 DEG C; (B) a photopolymerization initiator; (C) a binder resin; (D) a photopolymerizable compound; (E) a colorant; and (F) a solvent, an...

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Bibliographic Details
Main Authors JUNG, JU-HO, AHN, KYUNG-WON, CHOI, HYUN-MOO, YU, A-RUM, YIM, JAE-BUM, CHEON, HWAN-SUNG, KIM, JI-HYE
Format Patent
LanguageChinese
English
Published 16.06.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:Disclosed are a photosensitive resin composition including (A) a thermally curing initiator having a half-life of one hour at a temperature ranging from 100 to 150 DEG C; (B) a photopolymerization initiator; (C) a binder resin; (D) a photopolymerizable compound; (E) a colorant; and (F) a solvent, and a black spacer using the same.
Bibliography:Application Number: TW20132140015