Environmental sensitive electronic device package and manufaturing method thereof

• Main Authors: LEE, HSIAO-YEN, TSAI, PAO-MING, YAN, JING-YI, YEH, SHU-TANG, CHANG, YU-YANG, CHEN, KUANG-JUNG, CHEN, SHENG-WEI
• Format: Patent
• Language: Chinese; English
• Published: 16.06.2014
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TRANSPORTING

An environmental sensitive electronic device package including first substrate, second substrate, environmental sensitive electronic device, gas barrier structures, micro-structures, and filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate. The gas barrier structures are disposed between the first substrate and the second substrate and surround the environmental sensitive electronic device, wherein the gas barrier structures have first height. The micro-structure is disposed between the first substrate and the second substrate, wherein the micro-structures have second height. The ratio of the second height and the first height is range of 1/250 to 1/100. The filler layer is disposed between the first substrate and the second substrate and covers the environmental sensitive electronic device and the gas barrier structures. A manufacturing method of an environmental sensitive electronic device packa