Method for depositing solders on electronic component

A method for depositing solder on electronic component. First, provide a substrate with a top surface. Next, form a plurality of solders on the top surface. After that, place at least an electronic component on these solders. Each of the electronic components includes at least two soldering terminal...

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Bibliographic Details
Main Authors LI, YUN-TSUNG, CHIU, CHUNI, LI, HSUN-FA
Format Patent
LanguageChinese
English
Published 01.05.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method for depositing solder on electronic component. First, provide a substrate with a top surface. Next, form a plurality of solders on the top surface. After that, place at least an electronic component on these solders. Each of the electronic components includes at least two soldering terminals, and each of the soldering terminals is aligned to one of the solders. Next, heat these solders, so that these solders melt and respectively attach on the soldering terminals of the electronic components.
Bibliography:Application Number: TW20120139771