Cylindrical sputtering target and manufacturing method therefor

• Main Author: YOSUKE, MASANORI
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2014
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention readily and reliably joins a cylindrical target material and a backing tube, prevents damage to the cylindrical sputtering target, and improves the utilization ratio. One end part of the backing tube (40) is closed off by a dummy plug (60) to form a sealed end part (42). A molten joining material (30) is retained in a recessed joining-material-holding part (72) that is substantially circular in cross section and into which a backing tube provided to a joining-material-filling jig (70) can be inserted. The backing tube (40) with the sealed end part (42) facing downward is inserted with an interposing gap (g) into the interior of a target material (20) mounted on the joining-material-filling jig (70), and is inserted through the target material (20) into the joining-material-holding part (72), whereby the molten joining material (30) is pressed from the joining-material-holding part (72) and filled into the gap (g) between the internal peripheral surface of the target material (20) and the