Composite porous film having excellent heat resistance

A composite porous film is provided, which can sufficiently suppress thermal shrinkage even at a temperature beyond the melting temperature of a polyolefin resin and enhance the adhesion between a microporous film and a heat-resistant layer and suppress the peeling of an inorganic filler. The compos...

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Bibliographic Details
Main Authors SAKAMOTO, KAZUYUKI, ENOKI, NOBUO, ITOU, SHINGO, OOGI, YOSHIYUKI
Format Patent
LanguageChinese
English
Published 01.04.2014
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
SEPARATION
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:A composite porous film is provided, which can sufficiently suppress thermal shrinkage even at a temperature beyond the melting temperature of a polyolefin resin and enhance the adhesion between a microporous film and a heat-resistant layer and suppress the peeling of an inorganic filler. The composite porous film includes the heat-resistant layer containing the inorganic filler and a binder, and the microporous film containing the polyolefin resin. A primary particle diameter of the inorganic filler is 5 nm to 100 nm.
Bibliography:Application Number: TW20132127356