Aperture control of thermal processing radiation
Device for processing a substrate are described herein. Devices can include a radiation source and an aperture positioned to receive radiant energy from the radiation source. The aperture can include one or more members, and one or more interfering areas, wherein the interfering areas surround a tra...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
16.03.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Device for processing a substrate are described herein. Devices can include a radiation source and an aperture positioned to receive radiant energy from the radiation source. The aperture can include one or more members, and one or more interfering areas, wherein the interfering areas surround a transmissive area. The one or more structures can affect transmission of radiant energy through a portion of the transmissive area of the aperture. Structures disposed on the aperture can reduce or redirect transmission to provide for more uniform overall transmission of radiant energy through the aperture. |
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Bibliography: | Application Number: TW20130121162 |