Boiling cooling device

• Main Authors: OHTA, HARUHIKO, OHTANI, NOBUO, KOBAYASHI, HIROYUKI
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2014
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; BOILING; BOILING APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING; WEAPONS

The present invention provides an ebullient cooling device which achieves a high critical heat flux and is operable at a high pressure and a low temperature. Provided is an ebullient cooling device that comprises a closed chamber (10) which is provided with, at the bottom thereof, a heating part (11) to which heat from a heat source (3) is transmitted, and in which a refrigerant is sealed, and that cools the heat source (3) by transmitting the heat from the heating part (11) to the refrigerant. In the closed chamber (10), a first refrigerant and a second refrigerant that is insoluble in the first refrigerant are sealed, and in a state before the heat source (3) generates heat, the first refrigerant (21) in a liquid state, the second refrigerant (22) in a liquid state, and mixed vapor (23) containing the first refrigerant in a gas state and the second refrigerant in a gas state are present in the closed chamber (10).